Type

JCP350A

JCP350B

JCP350C

Coating methods

Two-target asymmetric bipolar pulse magnetron sputtering coating

Three-target magnetron co-sputtering coating

RF/DC magnetron sputtering coating + Evaporation coating

Film types

Metal films, Conducting films, Reaction films, Semiconductor films, Corrosion resisting films

Multi-layer films, Reaction films, Compound films, Hard films, Semiconductor films, Sensor films, Heat-resisting alloy films

Metal films, Dielectric films, Reaction films, Organic films, Corrosion resisting films, Heat-resisting alloy films

Power supply

500-W bipolar pulse power supply×2

500-W bipolar pulse power supply×3

500-W DC power supply ×1;
500-W RF power supply ×1;
500-W evaporation steady-flow power supply ×1

Structure of the sputtering target

Φ50.8 mm permanent magnetic target ×2 (reserve interface for evaporation coating)

Φ50.8 mm permanent magnetic target ×3 (reserve interface for evaporation coating)

Φ50.8 mm permanent magnetic target ×3, A pair of evaporation electrodes

Vacuum chamber

Pre-open vertical structures, Postposition pumping systems

Highest attained vacuum and leakage rate

6.6×10-5Pa; Leakage rate: from vacuum chamber pressure to lower than 10 Pa after turn of the power for about 12 h

Vacuum pumps

Molecular pump + Mechanical pump

Pumping speed

Pumping time≤20 min, from atmospheric pressure to 10-3Pa

Film uniformity

The fluctuations of the film thickness are less than 5%

Baking temperature of the workpiece

Adjustable and controllable from room temperature to 500 °C (PID Temperature Control)

Operation mode of the workpiece

Revolution, 0?20 rpm stepless speed change (adjustable and controllable)

Vacuum measurement

Digital composite vacuum gauge

Vacuum control

Available Manual /PLC/PLC+HMI Control (optional)

Gas flow control

1-3 Road gas flow control and the display system

Protection

Alarm and automatic protection function for water depletion, abnormal flow, over current flowing, over voltage, and electrical shutdown, etc.

Basic parameters

Power≥9KW; Served area: 10m2

Optional devices

Minus bias 0-300V/-1000V, Electromagnetic target and the power supply, Water cooling & recycling machine, Electromagnetic targets, Anti-sputtering cleaning, Film thickness monitoring