Appellation

JCP450 Vacuum Coating Equipment Series

type

A type

B type

C type

Coating mode

DC magnetron sputtering

Three-target sputtering

RF / DC magnetron sputtering+ evaporation*2

film types

Metal Film

Metal films, reaction film, magnetic film, multilayer film

Metal film dielectric film, reaction film, oxide film

Power type

2000W DC*1

1000W Bipolar Pulse Generator*3

500W DC*1

500W RF*1

500 Evaporation constant current source*1

Sputtering target structure

Permanent magnetic target*2

sizeΦ100mm

Permanent magnetic target*3

sizeΦ76.2mm

Permanent magnetic target*3

sizeΦ50.8mm

One pair of Evaporation electrodes

Vacuum chamber structure

Vertical structure from top to bottom after the ventilation system, manually open-air mention spring

Base pressure

6×10-5Pa(Molecular pump)6×10-4PaDiffusion pump

Vacuum system components

Molecular pump /  diffusion pump+ mechanical pumps

Pumping speed

less than or equal to 20min from the air to 10^-3Pa

membrane uniformity

≤±5%

Workpiece baking temperature

Adjustable controlled room temperature to 500 ° C (PID Temperature Control)

Workpiece operation mode

Public rotation, 0~20rpm, adjustable controlled CVT

Vacuum measurement

Digital composite vacuum gauge

Vacuum control

A BC type Manual or PLC Automatic Control

gas control

2/3 sets of gas control system,customers can also special requirements

Workpiece cleaning method

anti - splash Cleaning

protection

Equipment is being driven, under compaction, flow, over-voltage protection devices

power

≥12KW,area10m².

Option devices

Quartz oscillator thickness devices Hall ion source, cooling water circulating machines, Bias voltage