Coating methods

RF magnetron sputtering / Asymmetric bipolar pulse magnetron sputtering

Film types

Metal films, dielectric films, reaction films, oxide films

Power supply

pulse power supply;
RF power supply

Structure of the sputtering target

permanent magnetic target
resever magnetic target

Vacuum chamber

Pre-open vertical structures, Postposition pumping systems

Highest attained vacuum

Molecular pump (6.6×10-5 Pa); Diffusion pump (6.6×10-4 Pa)

Vacuum pumps

Molecular pump + Mechanical pump

Pumping speed

Pumping time≤20 min, from atmospheric pressure to 10-3Pa

Film uniformity

The fluctuations of the film thickness are less than 5%

Operation mode of the workpiece

Revolution, 0?20 rpm stepless speed change (adjustable and controllable)

Vacuum measurement

Digital composite vacuum gauges

Vacuum control

Available Manual /PLC/PLC+HMI Control

Gas flow control

2-3 Roads gas flow control

Protection

Alarm and automatic protection function for water depletion, abnormal flow, over current flowing, over voltage, and electrical shutdown, etc.

Basic parameters

Power≥12KW; Served area: 10m2

Optional devices

Quartz oscillator film thickness monitor, Hall ion source, Minus bias, Water cooling & recycling machine