Products

JCP600 Multi-target Magnetron Sputtering Series

Type

Type A

Type B

Type C

Coating method

Pulse magnetron sputtering

Three-target or multi-target magnetron sputtering

RF/Pulse magnetron sputtering

Film types

Metal films, reaction films.etc

Metal films, reaction films, magnetic films, multi-layer films

Metal films, dielectric films, reaction films, oxide films, organic films

Power supply

bipolar pulse power supply

bipolar pulse power supply electromagnetron target power supply

bipolar pulse power supply RF power supply

Structure of the sputtering target

rectangular target

cylindrical plane target electromagnetron target

cylindrical plane target

Vacuum chamber

Pre-open vertical structures, Postposition pumping systems, 0?20 rpm stepless speed change, Digital composite vacuum gauges, Vacuum measurement ranging from atmospheric pressure to 10-5Pa

Sample

Available water cooling, heating, revolution, rotation; Sample thickness monitoring and anti-sputtering cleaning

Highest attained vacuum

6.6×10-5 Pa

Vacuum pumps

Molecular pump + Mechanical pump

Pumping speed

Pumping time≤30 min, from atmospheric pressure to 10-3Pa

Film uniformity

The fluctuations of the film thickness are less than 5%

Baking temperature of the workpiece

Adjustable and controllable from room temperature to 300 °C (PID Temperature Control)

Vacuum control

Available Manual / PLC / PLC + HMI / PC Control (optional)

Gas flow control

Three Roads gas flow control

Protection

Alarm and automatic protection function for water depletion, abnormal flow, over current flowing, over voltage, and electrical shutdown, etc.

Basic parameters

Power≥12KW; Served area: 12m2

Optional devices

Quartz oscillator film thickness monitor, Hall ion source, minus bias, Deionized water cooling & cycling machine, electromagnetron targets and the power supply