Dimension of the chamber

Φ600×H600 mm double-layer water cooling

Power supply

bipolar pulse power supply, multi-arc target power supply, evaporation power supply, Electromagnetic power supply

Vacuum chamber

Pre-open vertical structures, Postposition pumping systems

Coating methods

Magnetron sputtering ( electromagnetic target,cylindrical plane target, rectangular target) + Multi-arc ion plating +Evaporation plating

Minus bias

optional

Workpiece support

Available water cooling, heating, 0-20 rpm adjustable stepless speed change revolution / rotation, Film thickness monitoring  

Vacuum pumps

Molecular pump + Mechanical pump / Diffusion pump + Mechanical pump

Highest attained vacuum

Molecular pump (6.6×10-5 Pa); Diffusion pump (6.6×10-4 Pa)

Pumping speed

Pumping time≤20 min, from atmospheric pressure to 10-3Pa

Film uniformity

The fluctuations of the film thickness are less than 5%

Baking temperature of the workpiece

Adjustable and controllable from room temperature to 300 °C (PID Temperature Control)

Vacuum control

Available Manual / PLC / PLC + HMI / PC Control (optional)

Gas flow control

3-5 Road gas flow control

Protection

Alarm and automatic protection function for waterdepletion, abnormal flow, over current flowing, over voltage, andelectrical shutdown, etc.

Basic parameters

Power≥20 KW; Served area: 12 m2

Optional devices

Quartz oscillator film thickness monitor, Hall ionsource, Water cooling & recycling machine, Air pump,Anti-sputtering cleaning